Design and fabrication of a re-configurable micromirror array for an optical microspectrometer [electronic resource] / Upadhyay, Vandana. [Tampa, Fla.] : University of South Florida, 2005. eng ABSTRACT: This thesis presents the design and fabrication of a re-configurable micromirror array which can be used as a component of an optical microspectrometer. In an optical microspectrometer, an array of mechanically positionable micromirrors can be implemented as a reconfigurable exit slit to selectively focus particular wavelengths of a diffracted spectrum onto the detector stage. The signal to noise ratio and response time of an optical microspectrometer can be vastly improved by this technique. In the approach presented here, a hybrid bulk- and surface- micromachining process is demonstrated for fabrication of a 1XN array of micromirrors. The reconfigurable micromirrors presented here comprise of two elements, a surfacemicromachined positioning mechanism, and a bulk-micromachined mirror. These elements are finally integrated using a flip-chip bonding technique. Thesis (M.S.E.E.)--University of South Florida, 2005. Includes bibliographical references. Text (Electronic thesis) in PDF format. System requirements: World Wide Web browser and PDF reader. Mode of access: World Wide Web. ABSTRACT: This thesis presents the design and fabrication of a re-configurable micromirror array which can be used as a component of an optical microspectrometer. In an optical microspectrometer, an array of mechanically positionable micromirrors can be implemented as a reconfigurable exit slit to selectively focus particular wavelengths of a diffracted spectrum onto the detector stage. The signal to noise ratio and response time of an optical microspectrometer can be vastly improved by this technique. In the approach presented here, a hybrid bulk- and surface- micromachining process is demonstrated for fabrication of a 1XN array of micromirrors. The reconfigurable micromirrors presented here comprise of two elements, a surfacemicromachined positioning mechanism, and a bulk-micromachined mirror. These elements are finally integrated using a flip-chip bonding technique. Adviser: Dr. Shekhar Bhansali. Co-adviser: Dr. Scott Samson. Thermal actuator. Polymumps. Anodic bonding. Gear. Pirl.
Design and fabrication of a re-configurable micromirror array for an optical microspectrometer [electronic resource] /
Upadhyay, Vandana.
[Tampa, Fla.] : University of South Florida,
2005.
eng
ABSTRACT: This thesis presents the design and fabrication of a re-configurable micromirror array which can be used as a component of an optical microspectrometer. In an optical microspectrometer, an array of mechanically positionable micromirrors can be implemented as a reconfigurable exit slit to selectively focus particular wavelengths of a diffracted spectrum onto the detector stage. The signal to noise ratio and response time of an optical microspectrometer can be vastly improved by this technique. In the approach presented here, a hybrid bulk- and surface- micromachining process is demonstrated for fabrication of a 1XN array of micromirrors. The reconfigurable micromirrors presented here comprise of two elements, a surfacemicromachined positioning mechanism, and a bulk-micromachined mirror. These elements are finally integrated using a flip-chip bonding technique.
Thesis (M.S.E.E.)--University of South Florida, 2005.
Includes bibliographical references.
Text (Electronic thesis) in PDF format.
System requirements: World Wide Web browser and PDF reader.
Mode of access: World Wide Web.
ABSTRACT: This thesis presents the design and fabrication of a re-configurable micromirror array which can be used as a component of an optical microspectrometer. In an optical microspectrometer, an array of mechanically positionable micromirrors can be implemented as a reconfigurable exit slit to selectively focus particular wavelengths of a diffracted spectrum onto the detector stage. The signal to noise ratio and response time of an optical microspectrometer can be vastly improved by this technique. In the approach presented here, a hybrid bulk- and surface- micromachining process is demonstrated for fabrication of a 1XN array of micromirrors. The reconfigurable micromirrors presented here comprise of two elements, a surfacemicromachined positioning mechanism, and a bulk-micromachined mirror. These elements are finally integrated using a flip-chip bonding technique.
Adviser: Dr. Shekhar Bhansali.
Co-adviser: Dr. Scott Samson.
Thermal actuator.
Polymumps.
Anodic bonding.
Gear.
Pirl.